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Function Modules

Analog Front-Ends

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By integrating our expertise in circuit design from high-precision measurement with High-reliability packaging technology, we deliver high-performance functional devices. Our capabilities include the modularization of sophisticated circuits (filters, amplifiers, oscillators, phase detectors, etc.). We support our clients through a seamless end-end system from design to mass production. We offer a wide range of standard products as well as fully customized products tailored to specific requirements.

Optimizing analog signal processing before the ADC is critical for system performance. We offer Analog Front Ends that integrate signal conditioning functions like amplification and filtering. 

Analog Signal
Processing

Low Noise

High Stability

Flexible Production

Sensing
Signal Amplification
Signal Conditioning
Signal Generation
Production Technology

Sensing

Impedance Measuring Module 

Equipped with signal application function to DUT and voltage/current measurement function. Acquiring the real and imaginary parts of impedance values ​​relative to a reference value.

Application
  • Impedance measurement of pharmaceuticals and food 

C/V Converter 

Capacitance-to-voltage converter capable of measuring minute capacitances. Dynamic range 100dB (resolution equivalent to 0.01pF)

Application
  • Measuring junction capacitance of transistors, diodes, etc. 
  • Measuring capacitance between patterns on printed circuit boards, etc. 

Signal Amplification 

Preamplifier 

Achieves the world’s highest level of input-equivalent noise voltage density at 0.25nV/√Hz. 
Supports a wide range of required specifications, including differential input/single-ended grounding, input impedance, and gain, depending on the input signal. 

Application
  • Amplification of minute signals from various sensors used in radar, sonar, analyzers, spectroscopes, etc.

Current-to-voltage Conversion Amplification 

Low Noise: Achieves the world’s highest input conversion noise current density of 2.5fA/√Hz. High gain and wide bandwidth of up to 10G (V/A) 

Application
  • Current-to-voltage conversion of infrared sensor output used in analyzers that measure blood flow, sugar content, etc. 
  • Signal amplification of photodiodes and photomultiplier tubes used to detect synchrotron radiation and weak light. 

Isolation Amplifier 

Input/output isolation: 1 kVrms, amplification: 0 to 20 dB, Frequency response: DC to 2 kHz

Application
  • Detecting small signals in high-voltage measurements 
  • Detecting signals with different reference potentials 

Charge Amplifier 

High sensitivity: 1 V/pC, Wide bandwidth: 160 Hz to 10 MHz 

Application
  • High sensitivity: 1 V/pC, Wide bandwidth: 160 Hz to 10 MHz 
  • Voltage conversion of charge transfer sensors, such as X-ray sensors 

Signal Conditioning 

Filter

LPF (Low Pass) / HPF (High Pass) / BPF (Band Pass) / BEF (Band Elimination) Butterworth, Bessel, Chebyshev, and Elliptic Chebyshev Frequency settings are set by external resistors, external control voltages, or logic signals 

Application
  • Anti-aliasing for A/D converters 
  • Frequency discrimination for communications, railway signals, etc. 

Phase Detector 

Input signal and reference signal are input to a multiplier to perform synchronous detection and detect the synchronous components of the two signals. 
Operating frequency range: 10 Hz to 2 MHz. Built-in low-pass filter, 90° phase shifter, and post-amplifier. 

Application
  • Spectroscopic analysis, physical property research, scanning probe microscopes, atomic force microscopes, magnetic measurements, and other small signal measurements 

Signal Generation 

CR oscillator/DDS Signal Generation Module 

ISignal generation module that can easily generate highly accurate and stable signals. 

Application
  • As a low-distortion reference signal (1 kHz for sensors, audio, etc.) 
  • A 90° phase-shifted signal source for radar and communications equipment 

Production Technology

Board Types

  • Glass-epoxy PCBs (Multilayer, Build-up)
  • Polyimide (PI) substrates
  • Ceramic substrates (Thick Film, HTCC, LTCC, Si3N4, AlN)
  • Metal core PCBs / Metal base PCBs (Aluminum, Copper)

Ceramic substrates

Assembly and Bonding

  • Mixed-technology assembly (Through-hole, SMD, and BGA)
  • COB (Chip-on-Board) mixed assembly (SMD and Bare die/chip)
  • Gold (Au) wire bonding
  • Heavy aluminum (Al) wire bonding for power devices

Gold wire bonding

Packaging

  • Ceramic packages
  • Metal packages
  • Cavity substrates / Substrates with cavities
  • Resin molding / Plastic encapsulation

Cavity substrates

Custom Embedded Solutions: Inquiries Welcome.